Your Position£ºHome > Products

 Product Center >> Small Electronic Components Industry >> a.Encapsulation or fixation of various small electronic components
6100A-31BT/113B-3 or 113 B-7 or 116 B-7 or 116 or 116
   Category
Tough packer epoxy Resin Compounds for Potting
   Characteristics
Mixture molding not flowing, good electrical property, environmental product
   Scope of application
Used for encapsulation, encapsulation or fixation of various small electronic components
   Product performance
                                                                                                       

Properties

Test Conditions

Unit

Index

Component A

-

-

6100A-31BT

Component B

-

-

113B-3

113B-7

116B-3

116B-7

Component A viscosity

40¡æ

mPa¡¤s

/

Component B viscosity

40¡æ

mPa¡¤s

20-60

5-20

Component A specific gravity

25¡æ

g/cm3

1.60¡À0.05

Component B specific gravity

25¡æ

g/cm3

1.13¡À0.02

0.97¡À0.02

Proportion(A/B)

by weight

-

100£º25

100£º15

Curing conditions

-

-

60¡æ/2h»ò24¡æ/24-36h

60¡æ/3-4h»ò25¡æ/36-48h

Hardness

25¡æ

ShoreD

¡Ý82

¡Ý77

Volume resistance

Normal

¦¸¡¤m

¡Ý1¡Á1012

¡Ý1¡Á1010

Dielectric constant

1MHz£¬25¡æ

3.9¡«4.5

4.3¡«5.0

Dissipation factor

1MHz£¬25¡æ

%

¡Ü1.5

¡Ü1.8

Electric strength

Normal

MV/m

¡Ý20

Water absorption

Normal 24h

%

¡Ü0.2

¡Ü0.3

Recruit Products Certificate News About us

E-mail:sales@chuangda-e.com.cn

Add£º201-1 Chengnan Road, Wuxi City, Jiangsu Province

Copyright © 2019-2020 Wuxi Jialian Electronic Materials Co., Ltd ËÕICP±¸08001780ºÅ-1