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Product Center >> Adhesive industry >> n Used for sealing, potting with bonding of inductive magnetic materials, coils, etc |
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Category |
One-component bound adhesive
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Characteristics |
High bonding strength, high Tg, low halogen content, high thixotropy, good temperature resistance, low CTE
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Scope of application |
Used for sealing, potting and bonding of inductive magnetic materials, coils, etc.
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Product performance |
6087GK
Properties
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Test
Conditions
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Unit
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Index
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Specific
gravity
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25¡æ
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g/cm3
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1.43¡«1.57
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Viscosity
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25¡æ/0.1rpm
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Pa¡¤s
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2000¡«6000
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25¡æ/1rpm
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Pa¡¤s
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300¡«800
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Curing
conditions
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-
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-
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110¡æ/120min
or 120¡æ/90min
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Hardness
(Shore D)
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25¡æ
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-
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¡Ý85
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Glass
transition temperature
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DSC£¬10¡æ/min
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¡æ
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¡Ý100
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Coefficient
of thermal expansion a1
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TMA£¬10¡æ/min
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m/m/K
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¡Ü6.0¡Á10-5
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Shear
adhesive strength
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Al-Al
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MPa
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¡Ý12
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Length
of sagging
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90º£¬0.1g
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mm
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¡Ü5
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Volume
resistance
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Normal
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¦¸¡¤cm
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¡Ý1.0¡Á1014
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Electric
strength
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Normal
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kV/mm
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¡Ý20.0
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