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| Product Center >> Adhesive industry >> a Used for sealing, potting with bonding of small electronic components such as relays, buzzers, sensors, protectors, etc. used in electronics with electrical industries |
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| Category |
| One-component epoxy sealant
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| Characteristics |
| Moderate curing temperature, fast curing speed,easy operation, the viscosity is moderate, the fluidity is moderate, high Tg, the temperature resistance is excellent, excellent electrical property, good resistance to acid and alkali£¬ the bonding strength is high
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| Scope of application |
| Used for sealing, potting and bonding of small electronic components such as relays, buzzers, sensors, protectors, etc. used in electronics and electrical industries
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| Product performance |
7101-015
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Properties
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Test
Conditions
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Unit
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Index
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Specific
gravity
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25¡æ
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g/cm3
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1.38¡À0.03
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Viscosity
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25¡æ£¬10RPM
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mPa¡¤s
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40000-60000
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Curing
conditions
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-
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-
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110¡æ/60min
+140¡æ/30min or 120¡æ/90min or 130¡æ/60min
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Hardness
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Shore
D
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25¡æ
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¡Ý85
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Shear
adhesive strength
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Al-Al
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MPa
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¡Ý12.0
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Glass
transition temperature
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DSC£¬10¡æ/Min
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¡æ
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¡Ý130
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Volume
resistance
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Normal
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¦¸¡¤m
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¡Ý1.0¡Á1013
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Electric
strength
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Normal
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MV/m
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¡Ý20
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Dielectric
constant
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1MHz£¬25¡æ
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-
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4.1¡«4.7
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